JPH025542Y2 - - Google Patents
Info
- Publication number
- JPH025542Y2 JPH025542Y2 JP1980178320U JP17832080U JPH025542Y2 JP H025542 Y2 JPH025542 Y2 JP H025542Y2 JP 1980178320 U JP1980178320 U JP 1980178320U JP 17832080 U JP17832080 U JP 17832080U JP H025542 Y2 JPH025542 Y2 JP H025542Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- metal lead
- lead
- soldering
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Ceramic Products (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980178320U JPH025542Y2 (en]) | 1980-12-12 | 1980-12-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980178320U JPH025542Y2 (en]) | 1980-12-12 | 1980-12-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57102146U JPS57102146U (en]) | 1982-06-23 |
JPH025542Y2 true JPH025542Y2 (en]) | 1990-02-09 |
Family
ID=29973004
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1980178320U Expired JPH025542Y2 (en]) | 1980-12-12 | 1980-12-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH025542Y2 (en]) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60138991A (ja) * | 1983-12-27 | 1985-07-23 | 田中貴金属工業株式会社 | リ−ド端子用ろう材付帯材 |
JP2008044009A (ja) * | 2006-07-19 | 2008-02-28 | Honda Motor Co Ltd | 熱膨張係数が異なる部材の接合方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS521066U (en]) * | 1975-06-23 | 1977-01-06 |
-
1980
- 1980-12-12 JP JP1980178320U patent/JPH025542Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS57102146U (en]) | 1982-06-23 |
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